KLA Corporation
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Kapitálová struktura
- Tržní kapitalizace
- 245,45 mld. US$
- Enterprise Value
- 247,3 mld. US$
- Hotovost
- 4,9 mld. US$
- Celkový dluh
- 6,15 mld. US$
- Čistý dluh
- 1,25 mld. US$
Valuace (TTM)
- P/E
- 51,47×
- P/E (fwd)
- 28,02×
- P/FCF
- 65,16×
- FCF výnos
- 1,53 %
- EV/EBITDA
- 40,84×
- P/S
- —
- P/B
- 38,67×
- Beta
- 1,44
Marže (TTM)
- Hrubá marže
- 61,30 %
- EBITDA marže
- 44,59 %
- Provozní marže
- 42,49 %
- Čistá marže
- 35,57 %
- FCF marže
- 27,74 %
Ziskovost a růst
- ROE (rentabilita kapitálu)
- 87,50 %
- Růst tržeb (YoY)
- 15,20 %
- Růst zisku (YoY)
- 13,80 %
Dividenda
- Dividendový výnos
- 0,49 %
- Roční dividenda
- 0,92 US$
- Výplatní poměr
- 21,86 %
- Datum ex-dividendy
- 2026-08-17
52týdenní rozpětí
- Aktuální
- 187,86 US$
- Pozice v pásmu
- 43 %
- Nad ročním minimem
- +91,50 %
- Pod ročním maximem
- -38,88 %
Cena v kontextu
- Historické maximum
- 301,71 US$
- Datum maxima
- 30. 6. 2026
- Zpět na maximum
- +60,60 %
- 200denní průměr
- 174,95 US$
- Odchylka od průměru
- +7,38 %
O společnosti
WebKLA Corporation, together with its subsidiaries, provides process control and process-enabling solutions for manufacturing wafers, reticles/masks, chemicals/materials, integrated circuits (ICs), packaged ICs, and printed circuit boards. It operates through three segments: Semiconductor Process Control; Specialty Semiconductor Process; and PCB and Component Inspection. The company offers inspection and review tools to identify, locate, characterize, review, and analyze defects on various surfaces of patterned and unpatterned wafers; chemical process control equipment; wired and wireless sensor wafers and reticles; wafer defect inspection, review, and metrology systems; reticle inspection and metrology systems; wafer inspection and metrology systems; semiconductor software solutions; KLA Pro systems; and specialty semiconductor manufacturing, benchtop metrology, surface characterization, material strength characterization, and electrical property measurement products. It also provides etch, plasma dicing, deposition and other wafer processing technologies and solutions; direct imaging, inspection, optical shaping, inkjet, and additive printing, as well as computer-aided manufacturing and engineering solutions; and components. In addition, the company offers service programs. It serves semiconductor, and semiconductor-related and electronic device manufacturers. The company operates in China, Taiwan, Korea, North America, Japan, Europe, Israel, and rest of Asia. The company was formerly known as KLA-Tencor Corporation and changed its name to KLA Corporation in July 2019. KLA Corporation was incorporated in 1975 and is headquartered in Milpitas, California.
Vedení společnosti
- Mr. Bren D. HigginsExecutive VP & CFO
- Ms. Mary Beth WilkinsonExecutive VP, Chief Legal Officer & Corporate Secretary
- Mr. Ahmad A. KhanPresident of Semiconductor Products & Customers
- Mr. Brian W. LorigExecutive Vice President of KLA Global Services
- Mr. Virendra A. KirloskarSenior VP & Chief Accounting Officer
- Dr. Ben Bin-Ming TsaiCTO & Executive VP of Corporate Alliances
- Mr. Kevin M. Kessel C.F.A.Vice President of Investor Relations
- Ms. Randi PolanichSenior VP & Chief Communications Officer
- Mr. John Van CampExecutive VP & Chief Human Resources Officer